The difference is the packaging method:

 

The small pixel pitch LED modules are based on the SMD surface-mounted technology. COB encapsulates the LED chip directly on the PCB circuit board and covers it entirely with a special resin. Mini LED packaging mainly includes two solutions: COB (Chip on Board) technology and IMD (Integrated Mounted Devices) integrated packaging technology. COB technology encapsulates LED chips directly onto the module substrate, and then integrally molds each large unit. IMD technology (N in 1) integrates two, four or six groups of RGB lamp beads into a small unit. MicroLED is a new generation of display technology, that is, LED miniaturization and matrix technology. Simply put, it is to thin-film, miniaturize, and array the LED (light-emitting diode) backlight, which can make the LED unit smaller than 50 microns, the same as OLED Each pixel can be individually addressed and driven to emit light (self-illumination).

 

The minimum pixel pitch of the COB LED module that MLED can currently make is P0.55mm, with a density of more than 3,000,000 pixels/㎡, and a 1080P high-definition LED TV can be realized in less than one square. For more details, please consult our sales team at sales@minled.net, Thank you.